ALPHA Heat Curable Edgebond, CF31-4010, EFD Syringe, 15 Gram, 10CC, CF31-4010 Series
Hisco #:264954-0015GME-1998
MFG #:264954.0015GME
Item must be ordered in multiples of 15
The ALPHA 264954.0015GME is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.
ALPHA 264954.0015GME Features:- Low viscosity with fast flow at room temperature enabling fast & efficient flow properties. Saves takt time with larger components
- Passes 3,000 Cycles -40 to 125°C 30 min (TCT) with SAC-305 alloy
- Contains Anhydrides
- Halogen-free
- NON-REWORKABLE
Product Description
The ALPHA 264954.0015GME is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.
ALPHA 264954.0015GME Features:- Low viscosity with fast flow at room temperature enabling fast & efficient flow properties. Saves takt time with larger components
- Passes 3,000 Cycles -40 to 125°C 30 min (TCT) with SAC-305 alloy
- Contains Anhydrides
- Halogen-free
- NON-REWORKABLE
Technical Information
Item must be ordered in multiples of 15