Vaculoy SnCX 100 Lead-Free Solder Bar, 2.2lbs
Hisco #:259084-1998
MFG #:259084
$
Manufacturer Lead Time When Not In Stock: 12 days
Minimum Order QTY: 91
Item must be ordered in multiples of 91
Item must be ordered in multiples of 91
The ALPHA 259084 is a zero silver lead-free alloy suitable for use in most wave, selective solder and HASL (Hot Air Solder Leveling) applications. ALPHA SnCX 100 delivers fast soldering, low drossing and low copper dissolution as compared to silver-bearing alloys.
ALPHA 259084 Features:- Bright and smooth solder fillet appearance with no surface cracks
- Excellent prodiction yeilds and out performs Sn99.3.Cu0.7 based materials
- Low dross generation delivered by Vaculoy process in conjunction with the addition of a dross reducing agent
- Low copper dissolution rate
- Lowers Total Cost of Ownership due to the lower material cost
- Compatible with various surface finishes
- Delivers good performance across different soldering processes
- Good solderability due to the fast wetting speed
- Solidus: 227 degrees Celcius
- Liquidus: 229 degrees Celcius
- CHardness 11.1 HV
- Density: 7.40
- Specific Heat Capacity: @100 oC 0.198 J/g/ oC
- Thermal Expansion Coefficient: (30 - 100 oC) μm/moC 25.3 (100 - 180 oC) μm/moC 26.6
- Tensile Stress: MPa 39.6
- Tensile Strain: % 6.3
- Yield Stress: MPa 34.2Elongation: % 46.8
- Copper Content: % 0.65 +/- 0.05%
- Nickel Content: 0.05 +/- 0.01%
- Germanium Content: ≤ 0.01%
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA 259084 is a zero silver lead-free alloy suitable for use in most wave, selective solder and HASL (Hot Air Solder Leveling) applications. ALPHA SnCX 100 delivers fast soldering, low drossing and low copper dissolution as compared to silver-bearing alloys.
ALPHA 259084 Features:- Bright and smooth solder fillet appearance with no surface cracks
- Excellent prodiction yeilds and out performs Sn99.3.Cu0.7 based materials
- Low dross generation delivered by Vaculoy process in conjunction with the addition of a dross reducing agent
- Low copper dissolution rate
- Lowers Total Cost of Ownership due to the lower material cost
- Compatible with various surface finishes
- Delivers good performance across different soldering processes
- Good solderability due to the fast wetting speed
- Solidus: 227 degrees Celcius
- Liquidus: 229 degrees Celcius
- CHardness 11.1 HV
- Density: 7.40
- Specific Heat Capacity: @100 oC 0.198 J/g/ oC
- Thermal Expansion Coefficient: (30 - 100 oC) μm/moC 25.3 (100 - 180 oC) μm/moC 26.6
- Tensile Stress: MPa 39.6
- Tensile Strain: % 6.3
- Yield Stress: MPa 34.2Elongation: % 46.8
- Copper Content: % 0.65 +/- 0.05%
- Nickel Content: 0.05 +/- 0.01%
- Germanium Content: ≤ 0.01%
Technical Information
Brand: Alpha
Weight: 2.20462
Country Of Origin: US
Tariff Code: 8003000100
$
Minimum Order QTY: 91
Item must be ordered in multiples of 91
Item must be ordered in multiples of 91