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ALPHA WS-820 Lead Free Water-Soluble Solder Paste, SACX0807, 87.5-4-M18, 500g Jar

Hisco #:157134-1998

MFG #:WS-820

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
$
Manufacturer Lead Time When Not In Stock10 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24

The ALPHA WS-820 is a Series WS-820 lead-free solder paste .

The ALPHA WS-820 Features:
  • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
  • Able to spread and wet using straight ramp or soak reflow profiles in air
  • High spread/wetting lead free paste compatible with lead free alloys and surface finishes
  • High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
  • Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
  • Cleanable with water based cleaning systems
The ALPHA WS-820 Specifications:
  • Series: WS-820
  • Product Type: Lead-Free Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SACX PLUS 0807
  • Applications: Soldering
  • Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Product Description

The ALPHA WS-820 is a Series WS-820 lead-free solder paste .

The ALPHA WS-820 Features:
  • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
  • Able to spread and wet using straight ramp or soak reflow profiles in air
  • High spread/wetting lead free paste compatible with lead free alloys and surface finishes
  • High Reflow Yield with IPC Class II Voiding performance when used to solder BGA components
  • Excellent wetting characteristics on all common surface finishes (including Entek HT OSP), JIS Spread 88.6% on Entek HT OSP
  • Cleanable with water based cleaning systems
The ALPHA WS-820 Specifications:
  • Series: WS-820
  • Product Type: Lead-Free Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SACX PLUS 0807
  • Applications: Soldering
  • Standards Met: IPC J-Std-004 ORH0, IPC Class II, IPC TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandAlpha
Weight: 1
Country Of Origin: MX
Tariff Code: 3810.10.01.00
UPC Code: No UPC

Additional Resources

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Minimum Order QTY: 24
Item must be ordered in multiples of 24
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