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ALPHA NR-330 VOC-Free No-Clean Solder Flux, 5 Gallon Pail

Hisco #:129736-0005-1998

MFG #:NR-330

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
$
Manufacturer Lead Time When Not In Stock21 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Product Description

The ALPHA NR-330 is a liquid no-clean flux that comes in a 5 gal pail. It provides good wetting and hole-fills with OSP-coated, bare copper boards.

ALPHA NR-330 Features:
  • Product Type: No-Clean Flux
  • Physical Form: Liquid
  • Chemical Composition: Rosin99.3sn/0.7cu and 96.5sn/3.5ag
  • Shelf Life: 18month
  • Applications: Soldering
  • Container Type: Pail
  • Capacity: 5gal
ALPHA NR-330 Specifications:
  • Bellcore compliant for assemblies requiring this standard,
  • VOC-free to help meet air quality regulations,
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows,
  • Thermally stable activators provide low solder bridging,
  • Reduces the surface tension between solder mask and solder to provide low solder ball frequency,
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics,
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag

Technical Information

BrandAlpha
AvailabilityIn Stock
Weight: 45
Country Of Origin: MX
Tariff Code: 3810909999
UPC Code: No UPC

Additional Resources

$
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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