Prima-Bond™ ME7159 Diamond Filler Epoxy Adhesive, 3 cc EFD Syringe, Paste
Hisco #:ME7159-1572
MFG #:ME7159
$
Manufacturer Lead Time When Not In Stock: 14 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The AI Technology ME7159 is a Series ME epoxy adhesive .
The AI Technology ME7159 Features:- Stress free
- Diamond filled
- Series: ME
- Product Type: Epoxy Adhesive
- Hardness: 80Shore A
- Material Compatibility: Alumina to Aluminum, Silicon to Copper
- Physical Form: Paste
- Cure Time: 30min
- Viscosity Measurement: 310000cP
- Shelf Life: 1yr
- Cure Type: Room 150°C
- Dielectric Strength: >750V/mil
- Maximum Operating Temperature: +150°C
- Container Capacity: 3cc
- Container Type: Syringe
- Applications: Bonding
Product Description
Technical Information
SDS/TDS
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Product Description
The AI Technology ME7159 is a Series ME epoxy adhesive .
The AI Technology ME7159 Features:- Stress free
- Diamond filled
- Series: ME
- Product Type: Epoxy Adhesive
- Hardness: 80Shore A
- Material Compatibility: Alumina to Aluminum, Silicon to Copper
- Physical Form: Paste
- Cure Time: 30min
- Viscosity Measurement: 310000cP
- Shelf Life: 1yr
- Cure Type: Room 150°C
- Dielectric Strength: >750V/mil
- Maximum Operating Temperature: +150°C
- Container Capacity: 3cc
- Container Type: Syringe
- Applications: Bonding
Technical Information
Brand: AI Technology
Additional Resources
$
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1