US_HISCO_SPIRE
Information notification:
Due to ongoing tariff updates, pricing is subject to change and may not reflect the latest surcharges. Learn more.
AI Technology logo

Prima-Bond™ EG7655 Epoxy Adhesive, EFD, 5 cc Frozen Syringe

Hisco #:EG7655-1572

MFG #:EG7655

$
Manufacturer Lead Time When Not In Stock15 days
Minimum Order QTY: 53
Item must be ordered in multiples of 53

The AI Technology EG7655 is a epoxy adhesive .

The AI Technology EG7655 Specifications:
  • Brand: Prima-Bond™
  • Product Type: Epoxy Adhesive
  • Material Compatibility: Alumina to Aluminum, Silicon to Copper
  • Physical Form: Paste
  • Container Capacity: Part A:1/2oz
  • Container Type: Syringe
  • Applications: Bonding

Product Description

The AI Technology EG7655 is a epoxy adhesive .

The AI Technology EG7655 Specifications:
  • Brand: Prima-Bond™
  • Product Type: Epoxy Adhesive
  • Material Compatibility: Alumina to Aluminum, Silicon to Copper
  • Physical Form: Paste
  • Container Capacity: Part A:1/2oz
  • Container Type: Syringe
  • Applications: Bonding

Technical Information

BrandAI Technology
$
 
Minimum Order QTY: 53
Item must be ordered in multiples of 53
North America's Premier Distributor of Mission Critical Materials © 2008-  Copyright Hisco – TestEquity LLC.  All rights reserved.